Aluminum nitride ceramic plate copper thickness and copper clad ceramic substrate double-sided copper cladding thickness

Whether it is aluminum nitride ceramic plate copper or alumina ceramic plate copper cladding is nothing more than in the ceramic substrate single-sided or double-sided to do copper metallization, the thickness of the conventional is 35 microns, generally below 500 microns can be done, the special need to do an assessment, whether you need to do more than the thickness of the metal copper, or according to the needs of the product and cost to determine the thickness of aluminum nitride ceramic plate copper cladding and copper cladding ceramic substrate double-sided copper cladding The thickness of the.

Ceramic copper clad substrate airtightness

Ceramic clad copper substrate after metallization copper thickness, you can achieve better conductivity, thermal conductivity, because the ceramic insulation is very good, copper conductivity and outstanding, airtightness or. There is a professional mass spectrometer leak detector to check the ceramic copper-clad substrate can be known to the airtightness.

Copper clad ceramic substrate size

Copper clad ceramic substrate size, copper clad ceramic substrate size is mainly based on customer production requirements to customize processing, conventional copper clad ceramic substrate mainly alumina clad ceramic substrate and aluminum nitride ceramic clad copper plate, only the size of the customer does not exceed the conventional alumina ceramic substrate maximum size 120mm * 120mm, aluminum nitride ceramic substrate maximum size 110mm * 140mm. special 200mm * 200mm need special customization.

Specification of copper-clad ceramic substrate

The specifications of copper clad ceramic substrate, divided into alumina clad ceramic substrate and aluminum nitride clad ceramic substrate, specifications, the maximum size of alumina not more than 120mm * 120mm, aluminum nitride maximum size not more than 110mm * 140mm, substrate thickness in 0.15mm ~ 3.0mm, copper thickness is generally the default 35 microns, can do 500 microns, specific work requirements or need to comprehensive assessment.

Thickness of the copper-laminated ceramic substrate

The thickness of the laminated ceramic substrate is the thickness of the plate plus the thickness of the metalized layer. For example, the thickness of the plate is 0.25MM, copper thickness is 35 microns, then the plate thickness is the thickness of the two conversions added together.

The advantages and disadvantages of copper-clad ceramic substrates

The advantages and disadvantages of copper-clad ceramic substrates, mainly in the ceramic substrate above, thought the use of ceramic substrates as a substrate, with good thermal conductivity, insulation properties, through the copper clad ceramic substrates, electrical properties are also very good. Copper-clad ceramic substrates and ceramic substrates have good thermal conductivity at the same time, but also has the characteristics of ceramic easy to break. Especially thin, such as alumina ceramic substrate 0.15MM thickness, relatively easy to break.