Characteristics of copper-clad ceramic substrates

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Surface roughness of copper-clad ceramic substrates

The surface roughness of copper-clad ceramic substrates is related to the copper thickness and production process, generally the surface roughness of copper-clad ceramic substrates needs to be controlled within 0.3 microns better.

The production process of copper-clad ceramic substrate

Copper clad ceramic substrate, also known as copper clad ceramic, is the use of DBC or dpc production process, the copper foil directly sintered on the ceramic surface and made of an electronic base material. The production process of direct copper clad ceramic substrate is mainly divided into DPC and DBC.

DBC direct copper cladding production process

DBC-Copper direct sintering to ceramic plate, is composed of ceramic substrate, bonding bonding layer and conductive layer, it refers to the special process method of copper foil directly bonded to the surface of alumina or alumina nitride ceramic substrate at high temperature, which has high thermal conductivity characteristics, high adhesion strength, excellent soft brazing and excellent electrical insulation properties, but can not be over the hole, poor precision, rough surface, due to the line width, can only be applied to DBC technology. Copper layer is thick, fast processing, cheap, can make multi-layer, suitable for large area production.

However, this technology cannot be over-hole, poor precision and low flatness (surface roughness). It is suitable for installation on products with large spacing and cannot be made in the precision industry. Nowadays, people's living standard is getting higher and higher, and the quality of products is more and more demanding

DPC direct copper cladding production process

DPC technology This technology uses vacuum sputtering for copper plating, which is an additional step compared to other processes. Its advantages are high precision. Good flatness, good bonding (within the relative range of use), and the possibility of over-hole. The disadvantage is that this technology can only produce thin plates (thickness <300μm), and it is more expensive, production is limited, resulting in frequent shipments of time can not be on time.

The above is a small share of the direct copper clad ceramic substrate classification, roughness, characteristics, production process to do a comprehensive elaboration, I believe you have a more in-depth understanding of the direct copper clad ceramic substrate, more details of the copper clad ceramic substrate can be consulted Winspower